发明名称 SUBSTRATE FOR WALLBOARD JOINT TAPE AND PROCESS FOR MAKING SAME
摘要 A multi-ply paper substrate is provided, which comprises at least two plies bonded to one another by an adhesive; a basis weight of 80-200 gsm; an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541; an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; and a CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494. Methods of making and using the paper substrate, products made therefrom, and uses of the paper substrate are also provided.
申请公布号 US2015211189(A1) 申请公布日期 2015.07.30
申请号 US201514681755 申请日期 2015.04.08
申请人 INTERNATIONAL PAPER COMPANY 发明人 ANDERSON DENNIS W.;SEALEY JAMES E.
分类号 D21H27/38;D21H25/04;D21H11/00;D21H27/32 主分类号 D21H27/38
代理机构 代理人
主权项 1. A method of making a multi-ply paper substrate, comprising using an air-laid papermaking machine, forming at least two layers, contacting one or both of the layers with an adhesive, and contacting the layers with one another, to form a two-layered web; and compressing the two-layered web, to make the paper substrate, the multi-ply paper comprising at least two plies bonded to one another by an adhesive;a basis weight of 80-200 gsm;an internal bond of 10-180 milli-ft.-lb/sq. in. as measured by TAPPI method 541;an MD tensile of 20-300 lbf/inch width as measured by TAPPI method 494; anda CD tensile of 10-300 lbf/inch width as measured by TAPPI method 494.
地址 Memphis TN US