METHOD AND DICING DEVICE OF PROCESSING TRANSPARENT SPECIMEN USING ULTRAFAST PULSE LASER

摘要

A transparent specimen cutting method is provided using ultrafast laser and a dicing device for machining the transparent specimen. The cutting method includes forming a focal point by generating and focusing an ultrafast laser beam which has a pulse width of 10 fs-10 ps from a laser source and a center wavelength corresponding to the bandwidth of a transparent specimen, transmitting energy to the inside of the transparent specimen using the focused pulse laser beam by positioning the focal point of the pulse laser beam such that the focal point is positioned in an inner area on the inside of the both side surfaces of the transparent specimen, and generating and propagating cracks by relatively moving the focal point or the transparent specimen along a cut line in a desired shape such that cracks are propagated on the transparent specimen at a distance from the movement line of the focal point.

主权项

1. A method of processing a transparent specimen, comprising:
forming a focal point by generating and focusing an ultrafast pulse laser beam from a laser source, the pulse laser beam having a pulse width approximately between 10 femtoseconds to 10 picoseconds and a central wavelength of the pulse laser beam corresponding to a transmission band of the transparent specimen; transferring energy to an inside of the transparent specimen using the focused pulse laser beam by positioning the focal point of the pulse laser beam between an upper surface and a bottom surface of the transparent specimen; and generating and propagating a crack by relatively moving the focal point or the transparent specimen along a cut line of a desired shape such that the crack includes a portion that is propagated on the transparent specimen at a distance from a movement line of the focal point.