| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method for a connection body, which makes an electronic component connected at a low temperature with a photo-curing type adhesive and which improves poor connection of the electronic component, and a connection method for the electronic component.SOLUTION: An electronic component 18 is arrayed on a transparent substrate 12 via an adhesive 1 for circuit connection, containing a photoinitiator. Heating and photoirradiation are performed while the electronic component 18 is pressed against the top of the transparent substrate 12, and the photoirradiation is completed while the heating and pressing are continued.</p> |
