| 摘要 |
<p>PROBLEM TO BE SOLVED: To inhibit warpage and inclination at the time of a cutting work in a semiconductor device in which a heat radiation surface of a heat sink opposite to a heat generating element is exposed from an encapsulation resin body by cutting of the encapsulation resin body.SOLUTION: A semiconductor device (10) comprises: a heat generating element (11); an encapsulation resin body (12) for encapsulating the heat generating element; and a first heat sink (14) which is arranged on one surface (11a) side of the heat generating element and thermally connected to the heat generating element. A lateral face (12c) of the encapsulation resin body has a tapered part corresponding to a draft angle of a die for molding the encapsulation resin body. The lateral face has: a first tapered part (30) between an apex part (20) corresponding to a matching part (104) of a die (100) and a first resin surface (12a) as a tapered part, the first tapered part (30) being connected to the first resin surface; and a first flat part (31) which is connected to the first tapered part and parallel with a first heat radiation surface (14a), for pressing the encapsulation resin body when exposing the first heat radiation surface in a thickness direction by cutting of the encapsulation resin body.</p> |
