| 发明名称 |
SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are a sensor package and a method of manufacturing the same. According to the embodiment of the present invention, a sensor package includes: a metal frame; a sensor chip formed on the metal frame and including a sensing part; a protective layer formed on the sensor chip and formed on remaining portions except for the sensing part; and a molding part formed to cover the metal frame and the sensor chip, wherein an upper surface of the protective layer and an upper surface of the molding part are disposed on the same surface. |
| 申请公布号 |
US2015216068(A1) |
申请公布日期 |
2015.07.30 |
| 申请号 |
US201414339188 |
申请日期 |
2014.07.23 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM Seoung Ho;Jeong Tae Sung;Jang Min Seok |
| 分类号 |
H05K7/14;H05K13/04 |
主分类号 |
H05K7/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sensor package, comprising:
a metal frame; a sensor chip formed on the metal frame and including a sensing part; a protective layer formed on the sensor chip and formed to have an opening at a position corresponding to the sensing part; and a molding part formed to cover the metal frame and the sensor chip, wherein an upper surface of the protective layer and an upper surface of the molding part are disposed on the same surface. |
| 地址 |
Suwon-Si KR |
