ISOLATION DEVICE

摘要

In one embodiment, an isolation device has a substrate, a metal plate, a conductive layer, first and second isolation layers are disclosed. The conductive layer may be formed within the substrate. The conductive layer may be arranged coupled to the metal plate, so as to receive a capacitively coupled signal from the metal plate. The first and second isolation layers may be sandwiched between the metal plate and the conductive layer. In another embodiment, an isolation device comprising a semiconductor substrate, a topmost metal layer and a plurality of additional metal layers is disclosed. The isolation device further comprises an isolation capacitor formed using the topmost metal layer and a conductive layer coupled to at least one of the plurality of additional metal layers.

主权项

1. An isolation capacitor, comprising:
a first capacitive element in electrical communication with a first circuit and having a first area; a second capacitive element in electrical communication with a second circuit that operates at a different voltage than the first circuit, wherein the second capacitive element comprises a second area that is different from the first area; and at least one isolation layer positioned between the first capacitive element and the second capacitive element, wherein the at least one isolation layer substantially prohibits electrical current from flowing between the first capacitive element and second capacitive element, thereby maintaining an electrical isolation between the first circuit and second circuit, and wherein the at least one isolation layer allows a capacitively coupled signal to travel between the first capacitive element and second capacitive element thereby enabling communication between the first circuit and second circuit even though the first circuit and second circuit are electrically isolated from one another.