发明名称 |
METHODS AND SYSTEMS FOR RELEASABLY ATTACHING SUPPORT MEMBERS TO MICROFEATURE WORKPIECES |
摘要 |
Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent. |
申请公布号 |
US2015214185(A1) |
申请公布日期 |
2015.07.30 |
申请号 |
US201514679834 |
申请日期 |
2015.04.06 |
申请人 |
Micron Technology, Inc. |
发明人 |
Pratt David;Hembree David R. |
分类号 |
H01L23/00;H01L21/78 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A method for processing a microfeature workpiece having a front side, a back side opposite the front side, and a plurality of microelectronic dies at the front side of the workpiece, the method comprising:
disposing an adhesive material in channels of a support member, wherein the support member carries a plurality of at least partially uncured support blocks separated from each other by a plurality of channels, and wherein the support blocks are arranged in a pattern such that the individual support blocks correspond to the dies of the workpiece; adhesively attaching the front side of the workpiece to the support member such that the individual dies of the workpiece contact the support blocks of the support member; removing material from the back side of the workpiece to thin the workpiece while the workpiece is attached to the carrier; cutting through the back side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the channels while the workpiece is attached to the carrier; and removing at least a portion of the adhesive material from the channels with a solvent to separate the dies from the adhesive material. |
地址 |
Boise ID US |