发明名称 HEAT SINK AND SEMICONDUCTOR DEVICE
摘要 A heat sink includes a frame having an opening, the opening extending in a thickness direction of the frame, the opening having a first opening part and a second opening part, the second opening part being larger than the first opening part in a plan view perpendicular to the thickness direction, a wall standing on the frame at an edge of the opening, a groove formed in the frame beside the wall, and a plate member including a first plate disposed in the first opening part and a second plate disposed in the second opening part and larger than the first plate in the plan view, wherein the second opening part is larger than the second plate in the plan view to leave a gap therebetween, and the wall is bent toward the opening to be in contact with an edge along a perimeter of the second plate.
申请公布号 US2015214131(A1) 申请公布日期 2015.07.30
申请号 US201414547347 申请日期 2014.11.19
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 YONEMOCHI Masahiro;TAKEUCHI Kesayuki;NEGORO Shuji;SEKI Masafumi
分类号 H01L23/367;H01L23/492;H01L23/42 主分类号 H01L23/367
代理机构 代理人
主权项 1. A heat sink, comprising: a frame member; and a plate member, wherein the frame member includes: a frame having an opening, the opening extending in a thickness direction of the frame from a first side of the frame to a second side of the frame, the opening having a first opening part situated toward the first side and a second opening part situated toward the second side, the second opening part being larger than the first opening part in a plan view perpendicular to the thickness direction of the frame; a wall standing on the frame on the second side at an edge of the opening; and a groove formed in the frame beside the wall on an opposite side of the wall from the opening side, wherein the plate member is disposed in the opening, and includes: a first plate part disposed in the first opening part; and a second plate part disposed in the second opening part and being larger than the first plate part in the plan view, and wherein the second opening part is larger than the second plate part in the plan view to leave a gap between an outer side surface of the second plate part and an inner surface of the second opening part, and the wall is bent toward the opening to be in contact with an edge along a perimeter of the second plate part.
地址 Nagano JP