PHOTORESIST, AND MANUFACTURING METHOD AND USAGE METHOD THEREFOR

摘要

Disclosed is a photoresist. The photoresist comprises: 1 to 90 parts of film-forming resin containing a hydroxyl or carboxyl group, 1 to 99 parts of vinyl ether monomer containing silicon and organic solvent which can dissolve the substances. Also disclosed are a manufacturing method and a usage method for the photoresist.