| 摘要 |
According to one aspect of the invention, there is provided a wafer dicing apparatus. The wafer dicing apparatus includes a grille, a vacuum suction unit and a cutter. The grille includes an alternating rib and slot arrangement for supporting a wafer, wherein one slot is between two adjacent ribs. The vacuum suction unit is in fluid communication with the grille and sucks air through at least one slot of the grille. The cutter dices the wafer, where either the grille, the cutter or both is configured to align the wafer to be diced along the rib of the grille. There is also provided a wafer dicing method. The method includes providing a wafer, stressing the wafer along a length that extends between two opposite points of the wafer perimeter, and dicing the wafer along the length where the wafer is stressed |
