WIRING BOARD AND MANUFACTURING METHOD OF THE SAME

摘要

To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.

主权项

1. A wiring board comprising a laminate, in which one or more resin insulating layers and one or more conductor layers are stacked,
wherein the conductor layer of an outermost laye of the laminate comprises:
a plurality of connection terminal portions, which are disposed in a mounting area of a semiconductor chip and surfaces of which are exposed for flip-chip mounting the semiconductor chip; anda wiring conductor that is arranged at a predetermined position between the plurality of connection terminal portions, and wherein the resin insulating layer of the outermost layer of the laminate comprises:
a dam portion for covering the wiring conductor; anda reinforcement portion, which is formed between the wiring conductor and the connection terminal portion adjacent to the wiring conductor and to be lower than a height of the dam portion, and which is concatenated with a side surface of the dam portion.