发明名称 CUTTING DEVICE
摘要 Provided is a cutting device including a machining table configured to float a workpiece having a plate shape, a laser radiation unit configured to radiate a laser beam onto the workpiece, a coolant injection unit configured to inject a coolant onto the workpiece, and a moving device configured to relatively move the workpiece with respect to the laser radiation unit and the coolant injection unit in a preset direction. In the cutting device, a scattering member configured to receive injection of the coolant from the coolant injection unit and scatter the coolant is installed at the machining table in front of the workpiece in a moving direction in which the workpiece relatively moves.
申请公布号 US2015209911(A1) 申请公布日期 2015.07.30
申请号 US201514682902 申请日期 2015.04.09
申请人 IHI Corporation 发明人 YAMADA Junichi
分类号 B23K26/30;C03B33/03;B23K26/08;B23K26/38;B23K26/14 主分类号 B23K26/30
代理机构 代理人
主权项 1. A cutting device comprising: a machining table configured to float a workpiece having a plate shape; a laser radiation unit configured to radiate a laser beam onto the workpiece; a coolant injection unit configured to inject a coolant onto the workpiece; and a moving device configured to relatively move the workpiece with respect to the laser radiation unit and the coolant injection unit in a preset direction, wherein the cutting device configured to relatively move the workpiece in a direction preset by the moving device while radiating a laser beam from the laser radiation unit to a heating area set on the workpiece to heat the heating area, and inject the coolant from the coolant injection unit to a cooling area set on the heated heating area to cool the cooling area, and a scattering member configured to receive injection of the coolant from the coolant injection unit and scatter the coolant is installed at the machining table in front of the workpiece in a moving direction in which the workpiece relatively moves.
地址 Tokyo JP