SEMICONDUCTOR-WAFER CLEANING TANK AND METHOD FOR MANUFACTURING BONDED WAFER

摘要

This invention is a semiconductor-wafer cleaning tank in which semiconductor wafers are immersed in a cleaning solution and cleaned. Said semiconductor-wafer cleaning tank is characterized by comprising the following: a quartz main tank body that holds the aforementioned cleaning solution, in which a plurality of semiconductor wafers are immersed; a quartz overflow-catching part that is provided around an opening in the main tank body and catches cleaning solution that has overflowed from the top edge of said opening; and a thermally insulating wall provided around the main tank body. This semiconductor-wafer cleaning tank is also characterized in that the thermally insulating wall forms an unbroken enclosure around the main tank body with a hollow layer formed between the thermally insulating wall and the side wall of the main tank body. A cleaning tank used in an etching step for film-thickness adjustment whereby bonded wafers that exhibit uniform film thickness even after said etching step can be manufactured with high yield is thus provided.