Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.
申请公布号
WO2015113024(A1)
申请公布日期
2015.07.30
申请号
WO2015US13019
申请日期
2015.01.27
申请人
CORNING INCORPORATED
发明人
MARJANOVIC, SASHA;PASTEL, DAVID ANDREW;PIECH, GARRETT ANDREW;QUINTAL, JOSE MARIO;TSUDA, SERGIO;WAGNER, ROBERT STEPHEN;YEARY, ANDREA NICHOLE