| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a curing accelerator for a curable epoxy resin, which lowers viscosity of a heat-melted mixture comprising an epoxy resin, a curing agent, and a curing accelerator and improves liquid flow characteristics thereof, and which can, on the other hand, improve demolding characteristics by raising initial hardness when curing and can also reduce halogens and alkali metal ions which give adverse effects to semiconductors.SOLUTION: Provided is an epoxy resin curing accelerator comprising a quaternary phosphonium salt represented by the general formula (1) which is obtained by a decarboxylation reaction between a quaternary phosphonium monoalkyl carbonate solution (B) and a phenolic compound (C), where a content of a tertiary phosphine (A) in the quaternary phosphonium salt is less than 5%. (In the formula, R1 to R5 are each independent substituent; R6 is an alkyl group having 1 to 16 carbons; and Xis an anion residue of the phenolic compound.)</p> |
