| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame for optical semiconductor excellent in resin supply and having high degree of freedom in design, by preventing occurrence of defects such as cracking, chipping, and partial peeling in a resin layer when demolding a resin molding for optical semiconductor, and to provide a resin molding for optical semiconductor using that lead frame and manufacturing method therefor, and an optical semiconductor package using that lead frame and optical semiconductor device.SOLUTION: A frame 12 is provided around an aggregation 11 continuously provided with a plurality of unit mounting areas 10 each consisting of more than one leads 20, 21 separated from each other. The frame 12 is provided with a groove 14 where a space, consisting of a gate 30 to which resin is supplied and an injection path 31 continuous thereto and supplying resin to a gap of the aggregation on the inside, is constituted. Out of the groove 14, at least a part becoming the outlet 31a of an injection path 31 at the inner end side of the frame 12 is a non-through groove leaving a thin part, in a lead frame for optical semiconductor. |
