发明名称 |
SCREEN PRINTING APPARATUS, ELECTRONIC COMPONENT MOUNTING SYSTEM AND SCREEN PRINTING METHOD |
摘要 |
A screen printing apparatus includes a substrate positioning part that upwardly and downwardly moves a substrate with the substrate clamped by a clamp member to thereby bring the substrate into contact with a mask stretched in a frame body and fixed in a predetermined height position from an underside of the mask and position the substrate in a predetermined height position, a mask suction part that is provided in the clamp member and sucks the mask in contact with the substrate, and a screen printing part that prints paste on the substrate through a pattern hole formed in the mask by sliding a squeegee on the mask to which the paste is supplied. The mask is pressed up by a predetermined amount through the substrate with the mask sucked by the mask suction part when the substrate is upwardly moved by the substrate positioning part. |
申请公布号 |
US2015216058(A1) |
申请公布日期 |
2015.07.30 |
申请号 |
US201514602540 |
申请日期 |
2015.01.22 |
申请人 |
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
发明人 |
MANTANI Masayuki;TOMOMATSU Michinori |
分类号 |
H05K3/34;B23K3/08;B23K3/00;B05C21/00;B05D1/32 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
1. A screen printing apparatus comprising:
a substrate positioning part that upwardly and downwardly moves a substrate with the substrate clamped by a clamp member to thereby bring the substrate into contact with a mask stretched in a frame body and fixed in a predetermined height position from an underside of the mask and position the substrate in a predetermined height position; a mask suction part that is provided in the clamp member and sucks the mask in contact with the substrate; and a screen printing part that prints paste on the substrate through a pattern hole formed in the mask by sliding a squeegee on the mask to which the paste is supplied, wherein the mask is pressed up by a predetermined amount through the substrate with the mask sucked by the mask suction part when the substrate is upwardly moved by the substrate positioning part. |
地址 |
Osaka JP |