发明名称 POWER MODULE AND MANUFACTURING METHOD THEREFOR
摘要 This invention provides a power module and the like having a reduced inductance and a reduced form factor. Said power module contains body sections (11 through 13), cooling sections (21 through 24) that cool said body sections (11 through 13), busbars (51, 52) connected to power terminals (1i, 1j) on the body sections (11 through 13), a tubular body (W), and a metal member (30) that supports said tubular body (W). At least the parts of the tubular body (W) that the busbars (51, 52) contact are electrically insulating. The tubular body (W) is in close contact with the metal member (30), forming a housing with one open side. At least the body sections (11 through 13) and the busbars (51, 52) are laid out inside said housing, and the inside of the housing is filled with an electrically insulating sealant.
申请公布号 WO2015111211(A1) 申请公布日期 2015.07.30
申请号 WO2014JP51643 申请日期 2014.01.27
申请人 HITACHI, LTD. 发明人 SHINTANI HIROSHI;IDE EIICHI;SASAKI KOJI;TANIE HISASHI
分类号 H01L25/07;H01L23/36;H01L25/18;H05K7/20 主分类号 H01L25/07
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