| 发明名称 |
POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are a power module package and a method of manufacturing the same. According to a preferred embodiment of the present invention, the power module package includes: a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. Therefore, it is possible to easily improve a thermal property of the power module package by a thermal spreading effect due to the thermal spreader. |
| 申请公布号 |
US2015214199(A1) |
申请公布日期 |
2015.07.30 |
| 申请号 |
US201414452524 |
申请日期 |
2014.08.05 |
| 申请人 |
Samsung Electro-Mechanics Co., Ltd. |
发明人 |
KIM Kwang Soo;CHAE Joon Seok;KWAK Young Hoon |
| 分类号 |
H01L25/16;H01L25/00;H01L21/56;H01L23/00;H01L23/31;H01L23/495;H01L23/373 |
主分类号 |
H01L25/16 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power module package, comprising:
a lead frame on which a power device and a control IC electrically connected to the power device and controlling the power device are mounted; and a thermal sheet bonded to one surface of the lead frame, wherein the thermal sheet includes first and second resin layers which include a thermal conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (Alkyl (C12 to C14) glycidyl ether), and a thermal spreader of a metal material disposed at a bonded interface which is formed between the first and second resin layers. |
| 地址 |
Suwon-Si KR |
