| 发明名称 |
STACKED INTERCONNECT HEAT SINK |
| 摘要 |
A method is provided. The method includes providing an integrated circuit having a substrate. The method also includes locating a via within the substrate. The method further includes connecting the via to a corresponding heat spreader via. The corresponding heat spreader via may pass through a thermally conductive core of a heat spreader. |
| 申请公布号 |
US2015214130(A1) |
申请公布日期 |
2015.07.30 |
| 申请号 |
US201514678223 |
申请日期 |
2015.04.03 |
| 申请人 |
Avago Technologies General IP (Singapore) Pte. Ltd |
发明人 |
Bachman Mark A.;Osenbach John W.;Merchant Sailesh M. |
| 分类号 |
H01L23/367;H01L21/768;H01L23/538 |
主分类号 |
H01L23/367 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming an electronic device, comprising:
providing an integrated circuit having a substrate; locating an active via within said substrate; and connecting said active via to a corresponding heat spreader via that passes through a thermally conductive core of a heat spreader. |
| 地址 |
Singapore SG |
