| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a processing method that can secure a sufficient number of acquirable device chips.SOLUTION: A wafer processing method comprises an annular groove forming step of making a core drill having an inner diameter substantially equal to the diameter of a device area (13) cut from a back surface (11b) of a wafer (11) into a depth corresponding to a finishing thickness (T) of the device area to form an annular groove (27) surrounding the device area, and a grinding step of grinding an inside area of the annular groove on the back surface of the wafer by a grind stone (18b) and reduce the wafer to the finishing thickness, thereby forming a concave portion (23) and forming an annular convex portion (25) surrounding the device area after the annular groove forming step is executed.</p> |
