发明名称 Tuning Strain in Semiconductor Devices
摘要 A Fin Field-Effect Transistor (FinFET) includes a semiconductor layer over a substrate, wherein the semiconductor layer forms a channel of the FinFET. A first silicon germanium oxide layer is over the substrate, wherein the first silicon germanium oxide layer has a first germanium percentage. A second silicon germanium oxide layer is over the first silicon germanium oxide layer. The second silicon germanium oxide layer has a second germanium percentage greater than the first germanium percentage. A gate dielectric is on sidewalls and a top surface of the semiconductor layer. A gate electrode is over the gate dielectric.
申请公布号 US2015214333(A1) 申请公布日期 2015.07.30
申请号 US201514677612 申请日期 2015.04.02
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Colinge Jean-Pierre;Ching Kuo-Cheng;Chang Gwan Sin;Wu Zhiqiang;Wang Chih-Hao;Diaz Carlos H.
分类号 H01L29/66;H01L29/78;H01L21/324;H01L29/165;H01L21/02;H01L21/306 主分类号 H01L29/66
代理机构 代理人
主权项 1. A method comprising: performing a first epitaxy to form a first silicon germanium layer over a substrate; performing a second epitaxy to form a second silicon germanium layer over the first silicon germanium layer; performing a third epitaxy to form a silicon layer substantially free from germanium over the second silicon germanium layer; oxidizing the first silicon germanium layer to form a first silicon germanium oxide layer; forming a gate dielectric on a top surface and sidewalls of the silicon layer, wherein the gate dielectric extends on sidewalls of the first silicon germanium oxide layer; and forming a gate electrode over the gate dielectric.
地址 Hsin-Chu TW