发明名称 |
Tuning Strain in Semiconductor Devices |
摘要 |
A Fin Field-Effect Transistor (FinFET) includes a semiconductor layer over a substrate, wherein the semiconductor layer forms a channel of the FinFET. A first silicon germanium oxide layer is over the substrate, wherein the first silicon germanium oxide layer has a first germanium percentage. A second silicon germanium oxide layer is over the first silicon germanium oxide layer. The second silicon germanium oxide layer has a second germanium percentage greater than the first germanium percentage. A gate dielectric is on sidewalls and a top surface of the semiconductor layer. A gate electrode is over the gate dielectric. |
申请公布号 |
US2015214333(A1) |
申请公布日期 |
2015.07.30 |
申请号 |
US201514677612 |
申请日期 |
2015.04.02 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Colinge Jean-Pierre;Ching Kuo-Cheng;Chang Gwan Sin;Wu Zhiqiang;Wang Chih-Hao;Diaz Carlos H. |
分类号 |
H01L29/66;H01L29/78;H01L21/324;H01L29/165;H01L21/02;H01L21/306 |
主分类号 |
H01L29/66 |
代理机构 |
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代理人 |
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主权项 |
1. A method comprising:
performing a first epitaxy to form a first silicon germanium layer over a substrate; performing a second epitaxy to form a second silicon germanium layer over the first silicon germanium layer; performing a third epitaxy to form a silicon layer substantially free from germanium over the second silicon germanium layer; oxidizing the first silicon germanium layer to form a first silicon germanium oxide layer; forming a gate dielectric on a top surface and sidewalls of the silicon layer, wherein the gate dielectric extends on sidewalls of the first silicon germanium oxide layer; and forming a gate electrode over the gate dielectric. |
地址 |
Hsin-Chu TW |