发明名称 |
SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF |
摘要 |
A substrate structure is provided, which includes: a substrate body having a plurality of conductive pads; an insulating layer formed on the substrate body and having a plurality of openings for correspondingly exposing the conductive pads; and a plurality of ring bodies formed in the openings and corresponding in position to edges of the conductive pads. As such, a plurality of conductive elements can be subsequently formed inside the ring bodies so as to be prevented by the ring bodies from expanding outward during a reflow process, thereby protecting the insulating layer from being compressed by the conductive elements and preventing cracking of the insulating layer. |
申请公布号 |
US2015214168(A1) |
申请公布日期 |
2015.07.30 |
申请号 |
US201414463049 |
申请日期 |
2014.08.19 |
申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Chang Cheng-An;Sun Sung-Huan;Liao Wen-Kai;Wu Chien-Hung;Chen Yi-Cheih |
分类号 |
H01L23/00;H05K1/03;H05K1/11 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. A substrate structure, comprising:
a substrate body having a plurality of conductive pads; an insulating layer formed on the substrate body and having a plurality of openings for correspondingly exposing the conductive pads; and a plurality of ring bodies formed in the openings and corresponding in position to edges of the conductive pads. |
地址 |
Taichung TW |