INTEGRATED PACKAGE ASSEMBLY FOR SWITCHING REGULATOR

摘要

In one embodiment, an IC package assembly for a switching regulator, can include: a power switch chip including a control electrode and a first electrode on an obverse side and a second electrode on a reverse side, where the second electrode is configured as a switching terminal of a switching regulator; a control chip including a driving electrode and a plurality of input and output electrodes on the obverse side; and a leadframe including an extension pin, a substrate, and a plurality of discrete pins, where the extension pin is formed integrally with the substrate, and where the reverse side of the power switch chip is arranged on the substrate of the leadframe by a conductive material to electrically connect the second electrode to the substrate.

主权项

1. An integrated circuit (IC) package assembly for a switching regulator, comprising:
a) a power switch chip comprising a control electrode and a first electrode on an obverse side and a second electrode on a reverse side, wherein said second electrode is configured as a switching terminal of a switching regulator; b) a control chip comprising a driving electrode and a plurality of input and output electrodes on said obverse side; c) a leadframe comprising an extension pin, a substrate, and a plurality of discrete pins, wherein said extension pin is formed integrally with said substrate, and wherein said reverse side of said power switch chip is arranged on said substrate of said leadframe by a conductive material to electrically connect said second electrode to said substrate; and d) said control electrode being electrically connected to said driving electrode, and said plurality of input and output electrodes of said control chip are electrically connected to corresponding of said discrete pins.