CONDUCTIVE FILM-FORMING BATH

摘要

The present invention addresses the issue of providing a novel conductive film-forming bath comprising an alkaline aqueous solution, that can be used when forming an electroplating film on a non-conductive plastic material, does not reduce adhesiveness to the non-conductive plastic material, and is capable of forming an electroplating film having a good external appearance. The present invention pertains to a conductive film-forming bath comprising an aqueous solution containing a water-soluble polymer having a copper compound, a complexing agent, an alkali metal hydroxide, and a polyoxyalkylene structure.