MEASUREMENT OF FILM THICKNESS ON AN ARBITRARY SUBSTRATE

摘要

Embodiments of the present disclosure enable measurement of film properties, such as thickness, using reflectometry regardless of the underlying pattern on the substrate or base layer because the amount of phase shift resulting from the growing film at any wavelength is independent of the substrate or base layer. One embodiment of the method includes determining properties of the substrate from a time series data. Another embodiment of the method includes removing a plasma background for measuring data by making two consecutive measurement with a light source on and off respectively. Another embodiment includes determining a deposition start time by monitoring a plasma marker or a phase shift of optical properties.