| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of a solder bridge.SOLUTION: A printed circuit board comprises: a semiconductor package 200 having an interposer 201 and a semiconductor element 202 mounted on one surface 211 of the interposer 201, in which a plurality of lands 220 are formed on the other surface 212 of the interposer 201; and a printed wiring board 301 including a plurality of lands 330 formed on an opposite surface 311 opposite to the other surface 212 of the interposer 201. The plurality of lands 330 of the printed wiring board 301 are grouped into a land group 341 composed of lands 331 connected to the lands 220 by solders 401 and a land group 342 composed of the lands 332 connected to an insulating member 350 by solders 402. The land group 342 is arranged in a region opposite to a predetermined region R centered at a center point Po of the other surface 212 of the interposer 201. The land group 341 is arranged around the land group 342 so as to surround the land group 342. |
