发明名称 RESIN COMPOSITION AND RESIN MOLDED OBJECT
摘要 [Object] To provide a halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products.;[Solving Means] A resin composition includes a component A which is a polycarbonate resin; a component B including organic sulfonic acid or organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight; a component C which is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight; and a component D which is a silicone compound, whose content is 0.1% or more and 2.0% or less by weight. Among hydrogen atoms in the silicone compound, the proportion of hydrogen atoms in phenyl groups is 51% or more; and/or the proportion of hydrogen atoms in hydrogen groups is 22% or more.
申请公布号 US2015210850(A1) 申请公布日期 2015.07.30
申请号 US201314420562 申请日期 2013.07.18
申请人 Sony Corporation 发明人 Yamada Atsushi;Ueda Kenji;Ohe Takahiro;Inagaki Yasuhito
分类号 C08L69/00 主分类号 C08L69/00
代理机构 代理人
主权项 1. A resin composition comprising: a component A being a polycarbonate resin; a component B being an organic sulfonic acid or an organic sulfonic acid metal salt, the content of the component B being 0.05% or more and 2.0% or less by weight; a component C being a drip inhibitor, the content of the component C being 0.05% or more and 1.0% or less by weight; and a component D being a silicone compound, among hydrogen atoms in the silicone compound, the proportion of the hydrogen atoms in phenyl groups being 51% or more and/or the proportion of the hydrogen atoms in hydrogen groups being 22% or more,the content of the component D being 0.1% or more and 2.0% or less by weight.
地址 Tokyo JP