发明名称 |
RESIN COMPOSITION AND RESIN MOLDED OBJECT |
摘要 |
[Object] To provide a halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products.;[Solving Means] A resin composition includes a component A which is a polycarbonate resin; a component B including organic sulfonic acid or organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight; a component C which is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight; and a component D which is a silicone compound, whose content is 0.1% or more and 2.0% or less by weight. Among hydrogen atoms in the silicone compound, the proportion of hydrogen atoms in phenyl groups is 51% or more; and/or the proportion of hydrogen atoms in hydrogen groups is 22% or more. |
申请公布号 |
US2015210850(A1) |
申请公布日期 |
2015.07.30 |
申请号 |
US201314420562 |
申请日期 |
2013.07.18 |
申请人 |
Sony Corporation |
发明人 |
Yamada Atsushi;Ueda Kenji;Ohe Takahiro;Inagaki Yasuhito |
分类号 |
C08L69/00 |
主分类号 |
C08L69/00 |
代理机构 |
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代理人 |
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主权项 |
1. A resin composition comprising:
a component A being a polycarbonate resin; a component B being an organic sulfonic acid or an organic sulfonic acid metal salt, the content of the component B being 0.05% or more and 2.0% or less by weight; a component C being a drip inhibitor, the content of the component C being 0.05% or more and 1.0% or less by weight; and a component D being a silicone compound,
among hydrogen atoms in the silicone compound, the proportion of the hydrogen atoms in phenyl groups being 51% or more and/or the proportion of the hydrogen atoms in hydrogen groups being 22% or more,the content of the component D being 0.1% or more and 2.0% or less by weight. |
地址 |
Tokyo JP |