| 发明名称 |
MEMS PACKAGE STRUCTURE |
| 摘要 |
A MEMS package structure including a chip, a MEMS device, a lid, a sealant and a first moisture barrier is provided. The chip comprises an active surface. The MEMS system device is disposed on the active surface. The lid is covered on the chip and comprising a recess, wherein the MEMS device is in the recess. The sealant is disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device. The first moisture barrier is sealed around the chip, the sealant and the lid. |
| 申请公布号 |
US2015210538(A1) |
申请公布日期 |
2015.07.30 |
| 申请号 |
US201414167819 |
申请日期 |
2014.01.29 |
| 申请人 |
Himax Display, Inc. |
发明人 |
Su Chun-Hao;Gelder Roland V.;Nauta Tore;Chen Wei-Hsiao |
| 分类号 |
B81B7/00;G02B27/00;G02B5/08 |
主分类号 |
B81B7/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microelectromechanical system (MEMS) package structure, comprising:
a chip, comprising an active surface a MEMS device, disposed on the active surface; a lid, covered on the chip and comprising a recess, wherein the MEMS device is in the recess; a sealant, disposed between the chip and the lid so as to seal the recess, wherein a thickness of the sealant is less than a height of the MEMS device; and a first moisture barrier, coated around the chip, the sealant and the lid. |
| 地址 |
Tainan City TW |
