| 摘要 |
<p>The present invention relates to a chip on glass bonding inspection apparatus which comprises: a base; an inspection object which is placed horizontally to the base; a first photographing device which is mounted in the base, is positioned in the lower part of an object to be inspected, and radiates visible rays to the object while moving in one direction (scanning direction) to the object, and photographs the lower part of the object using reflected light in a line scan type; a second photographing device which is mounted in the base, is positioned in the upper part of the object, radiates infrared rays to the object while moving in one direction (scanning direction) to the object, and photographs the upper part of the object using reflected light in the line scan type; a driving means which moves the first and second photographing devices in the scanning direction; and a controller which controls the driving means, and sends a first line trigger signal and a second ling trigger, signal synchronized with the moving speed in the scanning direction of the first and second photographing devices, to the first and second photographing devices, respectively. Therefore, the chip on glass bonding inspection apparatus can save inspection time, installation space, and installation costs thereof by performing an alignment inspection and an indentation inspection, conventionally conducted separately by different devices from each other, in one device at once.</p> |
