APPARATUS FOR MAPPING SEMICONDUCTOR SUBSTRATE LOADED IN FOUP

摘要

The present invention relates to an apparatus for mapping a semiconductor substrate loaded in a FOUP, which comprises: a FOUP (20) having a transparent window (22) in at least one surface thereof; an imaging means (30) obtaining an image of a loading position of a wafer (10) through the transparent window (22) of the FOUP (20); and a control means (40) determining acceptability of the loading position by receiving a signal of the imaging means (30). Therefore, in a process for manufacturing a semiconductor wafer, a loading state of a substrate accommodated in a FOUP for process treatment is quickly and accurately determined to prevent contamination by an external foreign substance.