| 摘要 |
<p>The present invention relates to an apparatus for transferring semiconductor packages onto a table. The apparatus comprises: a pickup panel which includes multiple vacuum holes for performing vacuum adsorption of semiconductor packages; a driving unit which moves the pickup panel in a vertical direction; and a control unit which controls the operation of the driving unit. The driving unit comprises: a motor; and a power transmitting device which converts the rotational force of the motor into a vertical linear driving force. In addition, the control unit stops the operation of the driving unit according to changes in the load of the motor after the semiconductor packages adsorbed to the pickup panel are attached to the upper part of a table.</p> |
