| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a microstructure molding method that can mold a thin and planar microstructure by one molding in which there is not a burr, and a microstructure is included in a plane part and an edge end part.SOLUTION: A microstructure molding method is that a coated film that is formed by that a molten resin applied to a lower mold is pressed by the lower mold and an upper mold, performed by isovolume temperature change, a microstructure is performed by transfer molding to a plane part and an edge end part of the coated film, and the same is performed by cooling solidification, and a planar microstructure that has the microstructure in the plane part and the edge end part and in which there is not a burr in the edge end part is molded, and includes: a step in which a planar coated film is formed to the lower mold; a step in which heating of the upper mold and the lower mold is begun and mold closing is performed, temperature rising is performed to a prescribed mold temperature and transfer molding of the microstructure is performed; and a step in which cooling of the upper mold and the lower mold is begun, the mold temperature becomes a prescribed temperature, then mold opening is performed, and a molded microstructure is taken out.</p> |
