| 摘要 |
Provided is a semiconductor module cooler capable of effectively cooling a semiconductor element. The semiconductor module cooler supplies a cooling medium to a cooling medium jacket (2) from the outside and cools a semiconductor element (13) which is provided on the outer surface of a heat sink (1) including fins (11). In the cooler, the cooling medium introduced from the outside is diffused in a cooling medium diffusion room (26), flows over a cooling medium diffusion wall (25), is introduced into a cooling fin cooling room (28) in which the fins (11) are arranged, cools the fins (11), and is discharged from a cooling medium discharge port (21) to the outside. |
