| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a vibration element which has a substrate side electrode arranged on one surface of an insulating substrate and a counter plate comprising a counter electrode arranged facing the substrate side electrode, and implements functions of decrease in an impedance, conversion of capacitance, signal amplification, etc., and in which element itself can be made compact, and a manufacturing method of the vibration element. <P>SOLUTION: An upper plate 1 formed of silicon single crystal is arranged so as to face the substrate side electrode 2. A holding section 31 for holding the upper plate 1 is interposed between a substrate 3 and the upper plate 1. The holding section 31 is provided with an integrated circuit section 5 being an impurity region of an IC circuit formed by, for example, a thermal diffusion method or ion implantation technique. Thus in the vibration element 10, improvement of conversion efficiency, improvement of productivity, and compactness of a packaging system are achieved. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
