| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element which is resistant to peeling at an opening of an insulation film covering a semiconductor layer even when a stress is applied from the outside to an electrode for connection. <P>SOLUTION: A semiconductor light-emitting element comprises: a p-type semiconductor layer 13 and an n-type semiconductor layer 12 which are connected to a p-side and n-side bump electrodes 17 and 18 by intermediate wirings 19 and 15; and an insulation layer 14 including p-side and n-side openings 19a and 15a which do not overlap the p-side and n-side bump electrodes 17 and 18 in a planar view. As a result, a stress does not concentrate on the openings 19a and 15a and the openings 19a and 15a are resistant to peeling. <P>COPYRIGHT: (C)2013,JPO&INPIT |
