发明名称 接続構造体の製造方法及び接続構造体
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a connection structure capable of improving conduction reliability between electrodes. <P>SOLUTION: A manufacturing method of a connection structure 1 according to the invention includes steps of: placing an anisotropic conductive material layer using anisotropic conductive material including conductive particles 5 on a first connection target member 2 having an electrode 2a on its top surface 2; changing the anisotropic conductive material layer to a B-stage by radiating light or heat from the top surface of the anisotropic conductive material to promote curing of the anisotropic conductive material layer; laminating a second connection target member 4 having an electrode 4b on its undersurface 4a on the top surface of the anisotropic conductive material layer of the B-stage; and forming a cured material layer 3 by curing the anisotropic conductive material layer of the B-stage. The degree of cure of the cured material layer 3 is made different between the cured material layer part 3a on the first connection target member 2 side and the cured material layer part 3b on the second connection target member 4 side. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5756637(B2) 申请公布日期 2015.07.29
申请号 JP20110011124 申请日期 2011.01.21
申请人 发明人
分类号 H01R43/00;H01B5/16;H01L21/60;H01R11/01;H05K1/14 主分类号 H01R43/00
代理机构 代理人
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