基板内蔵用積層セラミック電子部品及び積層セラミック電子部品内蔵型印刷回路基板

摘要

There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces, and first and second end surfaces, and having a thickness of 250μm or less, first and second internal electrodes alternately exposed to the first or second side surface, and first and second external electrodes formed on the first and second side surfaces, wherein the first external electrode includes a first electrode layer and a first metal layer, the second external electrode includes a second electrode layer and a second metal layer, the first and second external electrodes are extended onto the first and second main surfaces, and widths of the first and second external electrodes formed on the first and second main surfaces are different from each other.