| 摘要 |
<p>A solder composition for glass which comprises (by weight): 30-60 % indium, 0.01-11.0 % zinc, optionally 0.1-3.0 % copper, optionally 0.01-0.5 % manganese, optionally 0.01-0.5 % nickel, with the balance being tin. A preferred composition is (by weight): 30 % indium, 0.01 zinc and the balance tin. The composition can be in the form of a paste, ball, bar, wire, bump, plate, powder, pellet, ribbon, washer or ring and can be used to solder a terminal onto an electrode formed on a vehicle window.</p> |
