发明名称 電子部品用パッケージのベース、電子部品用パッケージ
摘要 <p>A base of an electronic component package holds an electronic component element. The base has a bottom face in a rectangular shape in plan view. The base includes a pair of terminal electrodes having a rectangular shape on the bottom face. The pair of terminal electrodes are to be bonded on an external circuit substrate with a conductive bonding material. The pair of terminal electrodes have mutually symmetrical shapes. Each of the terminal electrodes has a long side adjacent to or on an edge of a long side of the bottom face. The long side of each of the terminal electrodes is disposed parallel to the long side of the bottom face. The long side of each of the terminal electrodes has a length that is more than half a length of the long side of the bottom face.</p>
申请公布号 JP5757287(B2) 申请公布日期 2015.07.29
申请号 JP20120506938 申请日期 2011.03.11
申请人 发明人
分类号 H01L23/04 主分类号 H01L23/04
代理机构 代理人
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