摘要 |
A chemical mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) at least one type of an organic polymeric compound as a dispersing agent or charge reversal agent comprising a phosphonate (P(═O)(OR1)(OR2) or phosphonic acid (P(═O)(OH)2) moiety or their deprotonated forms as pendant groups, wherein R1 is alkyl, aryl, alkylaryl, or arylalkyl, R2 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium. |
申请人 |
BASF SE |
发明人 |
RAMAN, VIJAY IMMANUEL;LI, YUZHUO;SCHADE, CHRISTIAN;VENKATARAMAN, SHYAM SUNDAR;SU, EASON YU-SHEN;USMAN IBRAHIM, SHEIK ANSAR;GAO, NING |