| 摘要 |
<p>The present invention relates to a pad conditioner for a chemical-mechanical polishing (CMP) device, comprising: a base block which is installed in a peripheral area of a polishing pad of the CMP device; a rotation block which is installed in the base block to be exposed through the upper end of the base block; an arm support block which is coupled to the upper end of the rotation block to rotate together with the rotation block; a pivot arm which is disposed in parallel to the upper surface of the polishing pad and is coupled to the arm support block to rotate together with the arm support block; a conditioning head which is coupled to an end of the pivot arm to be disposed between the pivot arm and the polishing pad; a conditioning disk which is coupled to the conditioning head to be disposed between the polishing pad and the conditioning head; a disk rotating unit which rotates the conditioning disk; a disk linear driving unit which linearly moves the conditioning disk toward the polishing pad; and a block rotating unit which rotates the rotation block. The arm support block has a load cell placement groove from a side surface in a downside area of the opposite end to the end at which the conditioning head is formed, among both ends of the pivot arm. A pair of deformation guide grooves is formed along a direction in which the deformation guide grooves diverge from each other from the load cell placement groove. The pad conditioner includes, when a part disposed on the upper side than the deformation guide grooves in the arm support block is a pressurization arm support block part, a load cell which is installed in the load cell placement groove to measure force applied to the pressurization arm support block. Accordingly, it is possible to measure the contact pressure between the conditioning disk and the polishing pad.</p> |
