发明名称 |
Semiconductor light emitting element |
摘要 |
A semiconductor light emitting element comprises a semiconductor laminate including a p-type semiconductor layer, an active layer and an n-type semiconductor layer which are sequentially laminated; and a conductive support substrate joined to the p-type semiconductor layer side of the semiconductor laminate. The semiconductor laminate is divided into at least two semiconductor regions by a trench penetrating the p-type semiconductor layer, the active layer and the n-type semiconductor layer. |
申请公布号 |
US9093356(B2) |
申请公布日期 |
2015.07.28 |
申请号 |
US201113336667 |
申请日期 |
2011.12.23 |
申请人 |
NICHIA CORPORATION |
发明人 |
Ubahara Nobuhiko;Deguchi Kouichiroh;Yamada Takao |
分类号 |
H01L33/20;H01L27/15;H01L33/00;H01L33/08;H01L33/38;H01L33/40 |
主分类号 |
H01L33/20 |
代理机构 |
Foley & Lardner LLP |
代理人 |
Foley & Lardner LLP |
主权项 |
1. A semiconductor light emitting element comprising:
a semiconductor laminate including a p-type semiconductor layer, an active layer and an n-type semiconductor layer which are sequentially laminated; and a conductive support substrate joined to the p-type semiconductor layer side of the semiconductor laminate, wherein the semiconductor laminate is divided into at least two semiconductor regions by a trench penetrating the p-type semiconductor layer, the active layer and the n-type semiconductor layer, wherein the semiconductor light emitting element further comprises a continuous junction layer located between the conductive support substrate and the at least two semiconductor regions, at least a portion of the continuous junction layer being in direct contact with the semiconductor laminate of each semiconductor region, and wherein the semiconductor light emitting element further comprises a reflection layer at a bottom of the trench. |
地址 |
Anan-shi JP |