| 发明名称 | Compact device package | ||
| 摘要 | Various embodiments related to a compact device package are disclosed herein. In some arrangements, a flexible substrate can be coupled to a carrier having walls angled relative to one another. The substrate can be shaped to include two bends. First and second integrated device dies can be mounted on opposite sides of the substrate between the two bends in various arrangements. | ||
| 申请公布号 | US9093360(B2) | 申请公布日期 | 2015.07.28 |
| 申请号 | US201313739953 | 申请日期 | 2013.01.11 |
| 申请人 | ANALOG DEVICES, INC. | 发明人 | Bolognia David |
| 分类号 | H01L23/04;H01L21/00;H01L25/16;G06K9/00;H01L23/538;H01L25/18;H04R25/00;G06F3/01;H01L23/48 | 主分类号 | H01L23/04 |
| 代理机构 | Knobbe, Martens, Olson & Bear LLP | 代理人 | Knobbe, Martens, Olson & Bear LLP |
| 主权项 | 1. An integrated device package comprising: a carrier having at least two walls angled relative to one another; a substrate coupled to the carrier, the substrate having a first bend and a second bend; a first integrated device die mounted to a first side of the substrate between the first bend and the second bend; and a second integrated device die mounted to a second side of the substrate between the first bend and the second bend, the second side opposite the first side. | ||
| 地址 | Norwood MA US | ||