Manufacturing apparatus and method for semiconductor device

摘要

An apparatus for manufacturing a semiconductor device includes an out-heater including a heater element formed in an annular shape with a disconnected portion at one place, a first electrode component connected to a first heater electrode part of the heater element, a second electrode component connected to a second heater electrode part of the heater element, and a base including a first groove in which the first electrode component is fixedly disposed, and a second groove in which the second electrode component is movably disposed and a groove width in a circumferential direction of the heater element is formed such that a width of a second gap formed between a side of the second electrode component and an inner wall of the groove is wider than a width of a first gap formed between a side of the first electrode component and an inner wall of the first groove.

主权项

1. An apparatus for manufacturing a semiconductor device, comprising:
a reaction chamber into which a wafer is loaded; a gas supply mechanism configured to supply process gas to the reaction chamber; a gas discharge mechanism configured to discharge gas from the reaction chamber; a wafer support member configured to place the wafer within the reaction chamber; a rotation driving control mechanism configured to rotate the wafer along with the wafer support member; an out-heater including a heater element formed in an annular shape with a disconnected portion at one place and configured to heat the wafer support member to a predetermined temperature, a first heater electrode part integrally formed at one end portion of the heater element so as to project from a rear surface of the heater element, and a second heater electrode part integrally formed at the other end portion of the heater element so as to project from the rear surface of the heater element; a first electrode component connected to an end portion of the first heater electrode part, the first electrode component being positioned away from the heater element; a second electrode component connected to an end portion of the second heater electrode part, the second electrode component being positioned away from the heater element; and a base including a first groove in which the first electrode component is fixedly disposed, and a second groove in which the second electrode component is movably disposed and a groove width in a circumferential direction of the heater element is formed so as to be wider than a width of the second electrode component, the base being positioned away from the heater element.