Wire electric discharge machining apparatus, wire electric discharge machining method, thin plate manufacturing method, and semiconductor wafer manufacturing method

摘要

A wire electric discharge machining apparatus includes a wire electrode, a guide roller that arranges wire electrodes in parallel by winding the wire electrode therearound, a plurality of slidable contact conductors that are in slidable contact with the wire electrodes arranged in parallel, respectively, and a power feeding jig that holds the slidable contact conductors individually and feeds power individually to the wire electrodes arranged in parallel via each of the slidable contact conductors, in which the power feeding jig includes a plurality of reference surfaces that determine a fixing interval between the slidable contact conductors.

主权项

1. A wire electric discharge machining apparatus comprising:
a wire electrode; a guide roller that arranges wire electrodes in parallel by winding the wire electrode therearound; a plurality of slidable contact conductors that are in slidable contact with the wire electrodes arranged in parallel, respectively; and a power feeding jig that holds the slidable contact conductors individually and feeds power individually to the wire electrodes arranged in parallel via each of the slidable contact conductors, wherein the power feeding jig includes a plurality of reference surfaces that determine a fixing interval between the slidable contact conductors, a fixing jig in which the plurality of reference surfaces that determine a fixing interval between the slidable contact conductors is integrated, and a pressing jig that presses the slidable contact conductors against the reference surfaces.