发明名称 VTFT formation using capillary action
摘要 Producing a vertical transistor includes providing a conductive gate structure having a reentrant profile on a substrate. A conformal dielectric material layer is formed on the conductive gate structure. A conformal semiconductor material layer is formed on the dielectric material layer, over the conductive gate structure. An electrode is formed located over the conductive gate structure and in contact with a first portion of the semiconductor layer and another electrode is formed vertically separated from the electrode and located in contact with a second portion of the semiconductor layer by printing an inhibitor that wicks along the reentrant profile of the conductive gate structure and depositing a conductive inorganic thin film using an atomic layer deposition process where the inhibitor is absent to form a channel in the semiconductor layer along the reentrant profile between the electrodes by inhibiting deposition of conductive material between the electrodes with the wicked inhibitor.
申请公布号 US9093470(B1) 申请公布日期 2015.07.28
申请号 US201414198621 申请日期 2014.03.06
申请人 EASTMAN KODAK COMPANY 发明人 Nelson Shelby Forrester;Ellinger Carolyn Rae
分类号 H01L29/66;H01L21/8238;H01L27/108 主分类号 H01L29/66
代理机构 代理人 Zimmerli William R.
主权项 1. A method of producing a vertical transistor comprising: providing a conductive gate structure having a reentrant profile on a substrate; forming a conformal dielectric material layer on the conductive gate structure; forming a conformal semiconductor material layer on the dielectric material layer, over the conductive gate structure; forming a first electrode located over the conductive gate structure and in contact with a first portion of the semiconductor layer, and forming a second electrode vertically separated from the first electrode and located in contact with a second portion of the semiconductor layer, including: printing an inhibitor that wicks from a capillary action along the reentrant profile of the conductive gate structure; anddepositing a conductive inorganic thin film using an atomic layer deposition process where the inhibitor is absent to form the first and second electrodes, thereby defining a channel in the semiconductor layer in the reentrant profile between the first and second electrodes.
地址 Rochester NY US
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