发明名称 |
VTFT formation using capillary action |
摘要 |
Producing a vertical transistor includes providing a conductive gate structure having a reentrant profile on a substrate. A conformal dielectric material layer is formed on the conductive gate structure. A conformal semiconductor material layer is formed on the dielectric material layer, over the conductive gate structure. An electrode is formed located over the conductive gate structure and in contact with a first portion of the semiconductor layer and another electrode is formed vertically separated from the electrode and located in contact with a second portion of the semiconductor layer by printing an inhibitor that wicks along the reentrant profile of the conductive gate structure and depositing a conductive inorganic thin film using an atomic layer deposition process where the inhibitor is absent to form a channel in the semiconductor layer along the reentrant profile between the electrodes by inhibiting deposition of conductive material between the electrodes with the wicked inhibitor. |
申请公布号 |
US9093470(B1) |
申请公布日期 |
2015.07.28 |
申请号 |
US201414198621 |
申请日期 |
2014.03.06 |
申请人 |
EASTMAN KODAK COMPANY |
发明人 |
Nelson Shelby Forrester;Ellinger Carolyn Rae |
分类号 |
H01L29/66;H01L21/8238;H01L27/108 |
主分类号 |
H01L29/66 |
代理机构 |
|
代理人 |
Zimmerli William R. |
主权项 |
1. A method of producing a vertical transistor comprising:
providing a conductive gate structure having a reentrant profile on a substrate; forming a conformal dielectric material layer on the conductive gate structure; forming a conformal semiconductor material layer on the dielectric material layer, over the conductive gate structure; forming a first electrode located over the conductive gate structure and in contact with a first portion of the semiconductor layer, and forming a second electrode vertically separated from the first electrode and located in contact with a second portion of the semiconductor layer, including:
printing an inhibitor that wicks from a capillary action along the reentrant profile of the conductive gate structure; anddepositing a conductive inorganic thin film using an atomic layer deposition process where the inhibitor is absent to form the first and second electrodes, thereby defining a channel in the semiconductor layer in the reentrant profile between the first and second electrodes. |
地址 |
Rochester NY US |