| 发明名称 | Semiconductor device | ||
| 摘要 | A semiconductor device includes: a package including a base plate and a side wall located on a perimeter of the base plate; a semiconductor element on the base plate; and a lid joined to a top of the side wall and covering the semiconductor element, wherein a first curved surface is located inside the package at the top of the side wall, a second curved surface is located on a perimeter of an undersurface of the lid, and the first curved surface of the side wall contacts the second curved surface of the lid. | ||
| 申请公布号 | US9093309(B1) | 申请公布日期 | 2015.07.28 |
| 申请号 | US201414535919 | 申请日期 | 2014.11.07 |
| 申请人 | MITSUBISHI ELECTRIC CORPORATION | 发明人 | Hata Tadayoshi;Ogata Keizo |
| 分类号 | H01L23/10;B65D55/10;H01L23/04 | 主分类号 | H01L23/10 |
| 代理机构 | Leydig, Voit & Mayer, Ltd. | 代理人 | Leydig, Voit & Mayer, Ltd. |
| 主权项 | 1. A semiconductor device comprising: a package including a base plate and a side wall located on a perimeter of the base plate; a semiconductor element on the base plate; and a lid joined to a top of the side wall and covering the semiconductor element, wherein a first curved surface is located inside the package at the top of the side wall,a second curved surface is located on a perimeter of an undersurface of the lid, andthe first curved surface of the side wall contacts the second curved surface of the lid. | ||
| 地址 | Tokyo JP | ||