Enclosure for electronic components with enhanced cooling

摘要

An enclosure is provided and includes a frame defining an interior and a pathway, the frame being configured to prevent external air infiltration to the interior, a divider disposed to divide the interior into first and second chambers that are each fluidly communicative with the pathway and a blower including a cold-plate configured to cool first electronic components disposed on the cold plate, second electronic components disposed in the second chamber and third electronic components disposed in the first chamber by cycling air through the first chamber, the second chamber and the airflow pathway.

主权项

1. An enclosure, comprising:
a frame defining an interior and a pathway, the frame being configured to prevent external air infiltration to the interior; a divider disposed to extend from one side of the frame to an opposite side of the frame to divide the interior into first and second chambers that are each fluidly communicative with the pathway; and a blower disposed to at least partially traverse the divider and including a fan and a cold-plate adjacent to the fan on which first electronic components are disposed, the fan being configured to generate an airflow to cool the first electronic components disposed on the cold plate and then to cool second electronic components disposed in the second chamber, then to flow from the second electronic components into the pathway and then along the pathway into the first chamber, and then to cool third electronic components disposed in the first chamber.