| 发明名称 | Printed circuit board and method of manufacturing the same | ||
| 摘要 | Disclosed herein are a printed circuit board and a method of manufacturing the same. In detail, according to a preferred embodiment of the present invention, the printed circuit board includes: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. By doing so, the preferred embodiment of the present invention provides a printed circuit board including the metal layer having different crystal orientations to minimize factors of hindering electrical characteristics such as electric conductivity and improve isotropy of mechanical properties and a method of manufacturing the printed circuit board. | ||
| 申请公布号 | US9095063(B2) | 申请公布日期 | 2015.07.28 |
| 申请号 | US201414182206 | 申请日期 | 2014.02.17 |
| 申请人 | Samsung Electro-Mechanics Co., Ltd. | 发明人 | Yang Eun Ju;Kim Gyu Seok;Ham Suk Jin;Park Se Yoon;Cha Jin Uk;Chung Hee Suk;Kim Mi Yang |
| 分类号 | H05K1/09;H05K3/02;H05K1/03;C23F4/04;C23C14/34;H05K3/06 | 主分类号 | H05K1/09 |
| 代理机构 | Ladas & Parry, LLP | 代理人 | Ladas & Parry, LLP |
| 主权项 | 1. A printed circuit board, comprising: an insulating layer; and a metal layer formed on the insulating layer, wherein in the metal layer, a ratio occupied by crystal orientations of (110) and (112) is 20 to 80%. | ||
| 地址 | Gyunggi-Do KR | ||